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Discover the Truth of Materials: 21 Years global manufacturer of metallographic equipment and consumables.

Case
Trojan is your trusted partner for metallographic sample preparation. We are committed to helping you discover the truth of material — with precision, reliability, and innovation.Every material tells a different story — and requires a different approach. Our application specialists have developed optimized preparation procedures for:Titanium alloys, nickel-based super alloys, aluminum alloys, Hard/soft steels, cast iron, copper alloys. Ceramics, composites, thermal spray coatings. Semiconductors, PCBs, microelectronics.Rocks, minerals, and polymers.We work closely with each customer to develop customized preparation methods that deliver consistent, high-quality results for your specific materials and applications.
Printed Circuit Board
Purpose:Metallographic cross-sectioning is performed to examine voids, intermetallic compound (IMC) layers, and other potential defects in PCB solder joints. The specimen is prepared by sectioning using the Table Cut 200 automatic flatbed cutting machine, cold mounting with TJ2226 cold mounting resin, and grinding and polishing using the Alpha 610 automatic grinding and polishing machine. The detailed sample preparation procedure is described in the following preparation method.
2026 06 23
Metallographic Inspection of Chip Package Cross-Sectioning
Metallographic inspection of chip package cross-sectioning is a core technology for package failure analysis and quality control. By preparing cross-section samples through precise directional cutting, grinding, polishing and chemical treatment, the internal interconnection structure is directly observed via microscopic technology.
2026 06 10
Metallographic Examination of Al‑Sc Alloys
Metallographic inspection of aluminum‑scandium alloys is critical for ensuring their high‑performance applications. It serves as an indispensable quality control method for process monitoring, parameter optimization, and reliable use in aerospace, high‑end equipment, and other advanced fields.
2026 06 10
GH4169 Nickel-based Superalloy Metallographic Preparation
GH4169 nickel-based superalloy is widely applied in hot-section components of aero-engines, as well as high-temperature load-bearing structural parts for aerospace and energy industries.
2026 06 10
Electrolytic Etching Solution for Welded 304 Stainless Steel Specimens
To clearly observe the microstructure of 304 stainless steel welded joints including weld seam, heat-affected zone and base metal, and evaluate welding quality, phase composition & potential defects, proper etching treatment is essential.
2026 06 10
Cuprous Oxide (Cu₂O) Coating Preparation Solution
As a star coating in the field of catalysis, cuprous oxide (Cu₂O) coating is a typical p-type semiconductor with a band gap of approximately 2.2 eV. It can absorb visible light to initiate catalytic reactions, and is widely used in organic pollutant degradation, water splitting for hydrogen production, and other applications. Its catalytic activity directly depends on the microstructure and quality of the coating. Coatings prepared by electrochemical deposition, chemical reduction, and other methods can adhere tightly to the substrate and provide sufficient active sites for catalytic reactions.
2026 06 10
Schottky Diode Metallographic Preparation

Based on the metal-semiconductor junction forming a Schottky barrier, Schottky diodes conduct electricity through majority carriers without minority carrier storage effect. Their core advantages include ultra-low forward voltage drop (0.2–0.45V), extremely fast switching speed (ns level), and low power loss.
2026 05 25
Sample Preparation for TC4 Titanium Alloy by Selective Laser Melting (SLM) Additive Manufacturing
Following the fabrication of TC4 titanium alloy components using Selective Laser Melting (SLM) technology, metallographic analysis serves as the core method for evaluating internal quality and performance potential.
2026 05 25
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Email: info@trojanchina.com
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