Case
Trojan is your trusted partner for metallographic sample preparation. We are committed to helping you discover the truth of material — with precision, reliability, and innovation.Every material tells a different story — and requires a different approach. Our application specialists have developed optimized preparation procedures for:Titanium alloys, nickel-based super alloys, aluminum alloys, Hard/soft steels, cast iron, copper alloys. Ceramics, composites, thermal spray coatings. Semiconductors, PCBs, microelectronics.Rocks, minerals, and polymers.We work closely with each customer to develop customized preparation methods that deliver consistent, high-quality results for your specific materials and applications.
As a key wearable part for automatic sock knitting machines, this cutter ring trims excess yarn and separates finished socks automatically. It is made of SK5 spring steel, undergoing stamping, rolling, tooth milling and heat treatment. The cutting edge is locally coated with nickel-based diamond composite layer via electroplating, including pre-nickel plating, diamond grain co-deposition and final polishing.
2026 07 03
Ultra-small gold-plated stainless steel tubes (4mm × 0.55mm) combine the high strength, wear resistance and excellent air tightness of stainless steel with the low impedance, oxidation resistance and good solderability of gold plating. Widely used in precision electronics, optical communication, medical devices and RF connectors, these micro components serve for precision signal transmission and micro-sealing conduction, delivering long-term anti-corrosion performance for high-end miniaturized equipment.
2026 07 03
ENEPIG (Electroless Nickel-Palladium-Gold) stands as a dominant surface finish for high-performance PCBs. Built with compact, uniform Ni-Pd-Au triple-layer coating, it features superb oxidation & corrosion resistance plus low contact resistance.It eliminates black pad issues from conventional immersion gold while supporting both soldering and wire bonding for complex electronic assembly.
2026 07 01
Purpose：Metallographic cross-sectioning is performed to examine voids, intermetallic compound (IMC) layers, and other potential defects in PCB solder joints. The specimen is prepared by sectioning using the Table Cut 200 automatic flatbed cutting machine, cold mounting with TJ2226 cold mounting resin, and grinding and polishing using the Alpha 610 automatic grinding and polishing machine. The detailed sample preparation procedure is described in the following preparation method.
2026 06 23
Metallographic inspection of chip package cross-sectioning is a core technology for package failure analysis and quality control. By preparing cross-section samples through precise directional cutting, grinding, polishing and chemical treatment, the internal interconnection structure is directly observed via microscopic technology.
2026 06 10
Metallographic inspection of aluminum‑scandium alloys is critical for ensuring their high‑performance applications. It serves as an indispensable quality control method for process monitoring, parameter optimization, and reliable use in aerospace, high‑end equipment, and other advanced fields.
2026 06 10
GH4169 nickel-based superalloy is widely applied in hot-section components of aero-engines, as well as high-temperature load-bearing structural parts for aerospace and energy industries.
2026 06 10
To clearly observe the microstructure of 304 stainless steel welded joints including weld seam, heat-affected zone and base metal, and evaluate welding quality, phase composition & potential defects, proper etching treatment is essential.
2026 06 10
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