Trojan offers a complete solution for mounting accessories. Metal fixtures can be used to secure samples for hot mounting，while plastic fixtures are suitable for securing samples for cold mounting.

Trojan offers a complete solution for mounting accessories. Metal fixtures can be used to secure samples for hot mounting，while plastic fixtures are suitable for securing samples for cold mounting.

Mineral filled melamine resin.

DC 2239 is a conductive hot insert with a dark brown particle and powder.

EP 2237 is Glass fiber filled Epoxy with black grit appearance.

TM 2261 is transparent with white powder appearance.

BB-2232 is glass fiber filled Phenolic with black grit appearance.

The series of acrylic resin hot mounting materials produced by our company are suitable for mounting machines of various models and specifications at home and abroad. Using edge-preserving heat-mounting material, can protect the edge of the sample.
All metallographic mounting series products are made of special materials and special additives according to the characteristics of metallographic samples. After mounting, it is firmly and tightly combined with the sample, and it is not easy to create a gap with the edge of the sample, so as to avoid various external interferences.

EP 1001 is a rigid, fast-curing, two-component epoxy resin adhesive. The two components are mixed in a 10:1 volume ratio, and will cure bubble-free in approximately 5 minutes at 150 °C (302 °F). This system only reacts upon heating. Once cured, EP 1001 is resistant to most chemical etchants and does not outgas under vacuum conditions. A unique feature of EP 1001 is the red coloration that appears during curing. For optimal results, the epoxy should be cured based on the observed color change rather than curing time.

TJ 2400 is a single-component, UV-curable acrylic resin designed for rapid mounting of metallographic specimens. Upon exposure to UV light (365 nm wavelength), the resin cures within seconds to minutes into a transparent solid. It eliminates the need for mixing and weighing, simplifying the mounting process. The cured material offers good hardness, minimal shrinkage, and excellent edge retention, making it suitable for a wide range of metallographic and microsection sample preparation applications.

This epoxy resin is a special slow curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), it can be cured into transparent hard material after 10~15hours and the material can be polished and grinded. The material can meet the requirements of mounting various inorganic material samples. It has the advantages of good edge protection performance, good adhesion and very low shrinkage. It is suitable for microsection curing glue in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

This epoxy resin is a special slow curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), it can be cured into transparent hard material after 8~12hours and the material can be polished and grinded. The material can meet the requirements of mounting various inorganic material samples. It has the advantages of good edge protection performance, good adhesion and very low shrinkage. It is suitable for microsection curing glue in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.