Metallographic Sample Preparation Case for Silicon-Based Chips

Silicon-based chips are the core carrier of semiconductors, widely adopted in consumer electronics, new energy industrial controls, automotive chips, AI intelligent devices and more. Chip pads serve as critical structures for component packaging and pin interconnection, undertaking core functions including circuit conduction and signal transmission. The structural integrity of pads directly governs packaging yield and long-term device reliability.

At micro and nano-scale precision manufacturing processes, pads are prone to micro-defects. Therefore, cross-section metallographic slicing of pads has become a core procedure for quality control and failure analysis of chip packaging.

Metallographic microscopic inspection enables accurate detection of pad voids, uneven plating thickness, interface delamination, corrosion damage and other flaws, facilitating efficient troubleshooting of packaging process defects. Precise pad slicing and inspection deliver vital technical support for stable chip circuit conduction, improved packaging quality and reduced device failure risks.

Below is the metallographic preparation workflow for chip pad cross-section observation for your reference:

● Rough grind to target depth with P1200 abrasive paperFine grind sequentially with P2500 & P4000 abrasive paper

● Rough polishing: SC-JP cloth + 3μm PD-WT polycrystalline diamond suspension  

● Intermediate polishing: ET-JP cloth + 0.05μm AO-W alumina suspension

● Final mirror polishing: ZN cloth + SO-T401 silica polishing suspension