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Titanium Alloy

printed circuit board preparation procedure-2-wate (3)
printed circuit board preparation procedure-2-wate (3)

PurposeObserve the microstructure of titanium alloys. Titanium alloy blades are increasingly replacing aluminum alloys and precipitation-hardened stainless steels as the preferred material for compressor blades in aerospace engines due to their exceptional specic strength. These blades must withstand operational loads at temperatures below 500°C while maintaining high room-temperature strength and creep resistance. Samples undergo cutting (Beta-400MA), mounting (FLEXPRESS fully automatic modular hot mounting machine), grinding/polishing (Alpha610), and etching with Keller’s reagent for microscopic examination (MN80 metallographic microscope).

Basic Guide

Cutting1.Use titanium-specic resin-bonded silicon carbide cutting wheels. Refer to the Trojan Cutting Guide for specic models.

2.Select pulse mode for cutting, with a recommended maximum cutting speed 0.25 mm/s.

MountingUse high-edge-retention cold/hot mounting resin.

Grinding1.Begin with P400 silicon carbide sandpaper/lapping lms/diamond grinding discs until the sample surface is at and cutting damage is fully removed.

2.Continue ne grinding with P400, P800, P2000 sandpaper or a POS disc +9µm diamond polishing suspension.

3.Clean the sample, sample holder, and hands after each grinding step.

Polishing1.Clean the polishing cloth, sample holder, and hands before polishing. Repeat cleaning after each step.

2.Do not mix polishing disks with dierent abrasive particle sizes.

3.Rinse the sample surface with alcohol and dry with a blower to remove residue.

4.After each polishing step, inspect under a metallographic microscope to ensure scratch size matches the abrasive grit and direction is random.

5.Clean polishing cloths with running water and a soft brush after use, then air-dry.

6.Dedicate polishing cloths used for titanium alloys exclusively to such samples.

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