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Thermal Spray Coating (Ceramic Coating)

printed circuit board preparation procedure-2-wate (3)
printed circuit board preparation procedure-2-wate (3)

PurposeObserve the microstructure of thermal spray coatings. Thermal spraying is a technique that uses high-energy heat sources (e.g., ame, plasma, or electric arc) to heat spray materials (ultrane powders, wires, or rods of metals, non-metals, or ceramics) to a molten state. The atomized particles are accelerated to high velocities and sprayed onto a substrate to form functional surface coatings. Metallographic testing evaluates the coating-substrate interface, coating microstructure, porosity, cracks, and particle melting. Samples undergo cutting (TableCut200), mounting (TJ2568 cold-curing resin), grinding/polishing (Alpha610), and microscopic examination (MN80 metallographic microscope).

Basic Guide

Cutting1.Use resin-bonded alumina cutting wheels for metallic coatings or diamond cutting wheels for ceramic coatings. Refer to the Trojan Cutting Guide for specic models.

2.Select pulse mode for cutting, with a recommended maximum cutting speed 0.25 mm/s.

MountingUse high-edge-retention cold-curing epoxy resin with the pressure cold-mounting equipment.

Grinding1.Begin with P400 diamond grinding discs until the sample surface is at and cutting damage is fully removed.

2.Continue ne grinding with a POH disc + 9 µm diamond polishing suspension.

3.Clean the sample, sample holder, and hands after each grinding step.

Polishing1.Clean the polishing cloth, sample holder, and hands before polishing. Repeat cleaning after each step.

2.Do not mix polishing disks with dierent abrasive particle sizes.

3.Rinse the sample surface with alcohol and dry with a blower to remove residue.

4.After each polishing step, inspect under a metallographic microscope to ensure scratch size matches the abrasive grit and direction is random.

5.Clean polishing cloths with running water and a soft brush after use, then air-dry.

6.Dedicate polishing cloths used for thermal spray coatings exclusively to such samples.

7.After using silica polishing suspension, clean the bottle cap thoroughly before sealing.

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