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Discover the Truth of Materials: 21 Years global manufacturer of metallographic equipment and consumables.

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Trojan is your trusted partner for metallographic sample preparation. We are committed to helping you discover the truth of material — with precision, reliability, and innovation.Every material tells a different story — and requires a different approach. Our application specialists have developed optimized preparation procedures for:Titanium alloys, nickel-based super alloys, aluminum alloys, Hard/soft steels, cast iron, copper alloys. Ceramics, composites, thermal spray coatings. Semiconductors, PCBs, microelectronics.Rocks, minerals, and polymers.We work closely with each customer to develop customized preparation methods that deliver consistent, high-quality results for your specific materials and applications.
Metallographic Sample Preparation for Titanium
Alloys Titanium alloys feature high strength, low density, outstanding corrosion resistance and thermal stability, making them vital lightweight materials for advanced manufacturing. Balancing superior mechanical properties and reliability,
2026 09 30
Metallographic Inspection of Carbon Steel CO₂ GMAW Weld Joints

Metallographic examination of carbon steel weld joints fabricated via CO₂ gas metal arc welding serves as the core method to assess welding quality and process rationality.
2026 09 21
Silicon wafer cross-section preparation: minimizing damage to reveal the true structure

Silicon wafers are hard and brittle, making cross-section preparation particularly sensitive to edge chipping, microcracks, and subsurface damage. These preparation-induced artifacts can affect subsequent optical microscopy and SEM analysis.
2026 09 16
Stainless Steel Laser Welds: Reliable Evaluation Starts with Proper Preparation

Laser welding provides low heat input, minimal distortion, and precise weld geometry for stainless steel components. However, weld appearance alone cannot reveal the complete condition beneath the surface.
2026 09 04
Zirconium Zr705

Purpose:Sample preparation method of zirconium alloy. Zirconium Zr705, compared to traditional metals like iron, copper, and nickel, exhibits lower density, reduced thermal expansion coefficient, smaller thermal neutron absorption cross-section, and excellent corrosion resistance. These properties make zirconium and its alloys highly promising for specialized applications in nuclear, aerospace, and other industries. Samples undergo mounting (TJ-2568 epoxy resin), grinding, and polishing (Alpha-610).
2026 09 02
Titanium Alloy

Purpose:Observe the microstructure of titanium alloys. Titanium alloy blades are increasingly replacing aluminum alloys and precipitation-hardened stainless steels as the preferred material for compressor blades in aerospace engines due to their exceptional specific strength. These blades must withstand operational loads at temperatures below 500°C while maintaining high room-temperature strength and creep resistance. Samples undergo cutting (Beta-400MA), mounting (FLEXPRESS fully automatic modular hot mounting machine), grinding/polishing (Alpha610), and etching with Keller’s reagent for microscopic examination (MN80 metallographic microscope).
2026 09 02
Thermal Spray Coating (Ceramic Coating)

Purpose:Observe the microstructure of thermal spray coatings. Thermal spraying is a technique that uses high-energy heat sources (e.g., flame, plasma, or electric arc) to heat spray materials (ultrafine powders, wires, or rods of metals, non-metals, or ceramics) to a molten state. The atomized particles are accelerated to high velocities and sprayed onto a substrate to form functional surface coatings. Metallographic testing evaluates the coating-substrate interface, coating microstructure, porosity, cracks, and particle melting. Samples undergo cutting (TableCut200), mounting (TJ2568 cold-curing resin), grinding/polishing (Alpha610), and microscopic examination (MN80 metallographic microscope).
2026 09 02
Silicon Carbide Wafer

Purpose:Observe the cross-sectional microstructure of silicon carbide (SiC) wafers. Compared to first-generation silicon-based semiconductors, SiC exhibits superior electrical properties such as high voltage resistance, high temperature resistance, wide bandgap, and high thermal conductivity, making it a core material for third-generation semiconductors. It is widely used in new energy vehicle power devices, photovoltaics, and rail transportation. However, the high hardness and brittleness of SiC pose challenges in metallographic sample preparation. Samples undergo cold mounting (TJ2226 cold-curing resin), grinding/polishing (Alpha610), and a 5-step grinding/polishing process.
2026 09 02
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