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Discover the Truth of Materials: 21 Years global manufacturer of metallographic equipment and consumables.

Metallographic Inspection of Chip Package Cross-Sectioning
Metallographic inspection of chip package cross-sectioning is a core technology for package failure analysis and quality control. By preparing cross-section samples through precise directional cutting, grinding, polishing and chemical treatment, the internal interconnection structure is directly observed via microscopic technology.
2026 06 10
Metallographic Examination of Al‑Sc Alloys
Metallographic inspection of aluminum‑scandium alloys is critical for ensuring their high‑performance applications. It serves as an indispensable quality control method for process monitoring, parameter optimization, and reliable use in aerospace, high‑end equipment, and other advanced fields.
2026 06 10
GH4169 Nickel-based Superalloy Metallographic Preparation
GH4169 nickel-based superalloy is widely applied in hot-section components of aero-engines, as well as high-temperature load-bearing structural parts for aerospace and energy industries.
2026 06 10
Electrolytic Etching Solution for Welded 304 Stainless Steel Specimens
To clearly observe the microstructure of 304 stainless steel welded joints including weld seam, heat-affected zone and base metal, and evaluate welding quality, phase composition & potential defects, proper etching treatment is essential.
2026 06 10
Cuprous Oxide (Cu₂O) Coating Preparation Solution
As a star coating in the field of catalysis, cuprous oxide (Cu₂O) coating is a typical p-type semiconductor with a band gap of approximately 2.2 eV. It can absorb visible light to initiate catalytic reactions, and is widely used in organic pollutant degradation, water splitting for hydrogen production, and other applications. Its catalytic activity directly depends on the microstructure and quality of the coating. Coatings prepared by electrochemical deposition, chemical reduction, and other methods can adhere tightly to the substrate and provide sufficient active sites for catalytic reactions.
2026 06 10
Schottky Diode Metallographic Preparation

Based on the metal-semiconductor junction forming a Schottky barrier, Schottky diodes conduct electricity through majority carriers without minority carrier storage effect. Their core advantages include ultra-low forward voltage drop (0.2–0.45V), extremely fast switching speed (ns level), and low power loss.
2026 05 25
Sample Preparation for TC4 Titanium Alloy by Selective Laser Melting (SLM) Additive Manufacturing
Following the fabrication of TC4 titanium alloy components using Selective Laser Melting (SLM) technology, metallographic analysis serves as the core method for evaluating internal quality and performance potential.
2026 05 25
Metallographic Sample Preparation Procedure for FeCrAl Alloy
FeCrAl alloy is a high-performance electrothermal alloy widely used in industry, featuring outstanding advantages such as high electrical resistivity, excellent high-temperature resistance, strong oxidation resistance, and long service life. It maintains stable microstructure under high-temperature operating conditions and is resistant to deformation and failure. It is extensively applied in industrial electric furnace heating elements, household appliance heating elements, high-temperature kilns, heat treatment equipment, and aerospace high-temperature heating components — making it an indispensable key material in high-temperature electrothermal and heat-resistant structural applications.
2026 05 25
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