Pure Copper
Purpose：Observe the microstructure of pure copper. The pure copper sample undergoes cutting (CT-250S), mounting (FLEX-PRESS automatic modular hot mounting machine), grinding and polishing (Alpha-610), and surface treatment inspection under a microscope (MN80). The sample is then etched using ferric chloride and hydrochloric acid aqueous solution to observe its microstructure.
Basic Guide：
Cutting：1.Pure copper hardness is approximately 100HV. Select an S20 silicon carbide grinding wheel cutting blade. Refer to the Trojan Cutting Guide for specific model selection.
Mounting：Use universal hot mounting resin (PT-2231) for mounting process.
Grinding：1.Use P400 SiC sandpaper/grinding disc for rough grinding until the sample surface is flat and the cutting damage layer is fully removed.
2. After rough grinding, use a POS disc with 9μm diamond polishing suspension for further grinding.
3.Clean the sample and fixture with water after each grinding step.
Polishing：1.Before polishing, clean the polishing cloth, fixture, and hands. Repeat cleaning after each polishing step.
2.Do not mix polishing discs with different abrasive particle sizes.
3.Rinse the sample surface with alcohol and dry it with a blower to remove residual water.
4.After each polishing step, inspect the scratch patterns under a metallographic microscope to ensure their size matches the polishing grit and direction is randomized.
5.If scratches remain after YS polishing, extend polishing time by 3–5 minutes.
6.Clean used polishing cloths with running water and a soft brush, then store them after draining.
