Pure Copper
Purpose：Observe the microstructure of pure
copper. The pure copper sample undergoes cutting (CT-250S), mounting
(FLEX-PRESS automatic modular hot mounting machine), grinding and polishing
(Alpha-610), and surface treatment inspection under a microscope (MN80). The
sample is then etched using ferric chloride and hydrochloric acid aqueous
solution to observe its microstructure.
Basic
Guide：
Cutting：1.Pure
copper hardness is approximately 100HV. Select an S20 silicon carbide grinding
wheel cutting blade. Refer to the Trojan Cutting Guide for specific model selection.
Mounting：Use
universal hot mounting resin (PT-2231) for mounting process.
Grinding：1.Use
P400 SiC sandpaper/grinding disc for rough grinding until the sample surface is
flat and the
cutting damage layer is fully removed.
2.
After rough grinding, use a POS disc with 9μm diamond
polishing suspension for further grinding.
3.Clean
the sample and fixture
with water after each grinding step.
Polishing：1.Before
polishing, clean the polishing cloth, fixture,
and hands. Repeat cleaning after each polishing step.
2.Do
not mix polishing discs with different
abrasive particle sizes.
3.Rinse
the sample surface with alcohol and dry it with a blower to remove residual
water.
4.After
each polishing step, inspect the scratch patterns under a metallographic
microscope to ensure their size matches the polishing grit and direction is
randomized.
5.If
scratches remain after YS polishing, extend polishing time by 3–5 minutes.
6.Clean
used polishing cloths with running water and a soft brush, then store them
after draining.
