In high-precision manufacturing industries such as semiconductor and PCB, sample preparation has always been a critical step in quality inspection — it is not only time-consuming and labor-intensive, but also demands a high level of technical expertise and experience from operators. How to achieve fast, precise, and repeatable sample preparation has become a bottleneck for many enterprises seeking to improve quality and efficiency.
Now, a truly breakthrough intelligent device that overcomes the limitations of traditional sample preparation methods is here!
The WIT-1 Fully Automatic Intelligent Sample Preparation System is specifically developed for cross-section slicing inspection in semiconductor, PCB, and related industries. It can be applied to precise positioning, slicing, detection, and analysis of PCB vias, solder joints, solder balls, and more. It enables fully automated workflow — from positioning, grinding, and polishing to cleaning. Leveraging advanced visual positioning and multi-station coordination, the system significantly improves sample preparation efficiency and consistency, truly achieving "unattended" intelligent operation.
Ten Core Advantages — Defining "Efficient & Precise"
● High Precision, Wide Field of View
Utilizes a high-precision CCD lens to calibrate grinding positions with accuracy up to ±10μm; wide field of view enables rapid and reliable positioning.
● One-Time Calibration of Multiple Grinding Lines
Supports one-time calibration of multiple grinding lines on the same sample, with automatic sequential grinding — no manual intervention or repeated calibration required.
● Automatic Angle Adjustment
For samples with mounting tilt, the system automatically adjusts the left-right angle to achieve a level position.
● Multi-Sample Simultaneous Grinding
Supports clamping up to 3 samples simultaneously for grinding and polishing, delivering significant efficiency gains.
● Intelligent Pressure Control
Downward pressure and speed on the sample are precisely adjustable, effectively preventing sample cracking or fracture caused by excessive force.
● Laser Marking for Traceability
Equipped with laser marking or coding capability for sample traceability.
● Dual Working Discs
Dual working discs with automatic grinding disc replacement; accommodates up to 20 grinding discs.
● Grinding Surface Photo Documentation
Capable of photographing the finished grinding surface for subsequent analysis and archival management.
● Four Polishing Suspension Groups with Flexible Configuration
Configured with 4 groups of different polishing suspensions — 2 groups feature mechanical stirring, and all 4 groups are equipped with liquid level alarms.
● Fully Automatic Cleaning & Recovery
The cleaning station integrates ultrasonic cleaning, water rinsing, and air blow-drying. Processed samples are automatically arranged in a recovery tray with the ground surface facing up, effectively preventing scratches.