New Product Launch! This "Hardcore" Equipment Empowers Micron-Level Grinding & Polishing!

SemiPOL enables precise grinding and polishing of various materials (optical lenses, semiconductor wafers, metallic and non-metallic crystalline phases) for microscopic analysis (SEM, FIB, TEM, etc.), targeting micron-level precision. 

Primarily designed for parallel grinding and polishing, it can be combined with additional accessories to facilitate easier grinding and polishing of complex irregular workpieces and surfaces.

It features real-time monitoring of material removal, or quantified setting of material removal amounts for unattended operation. Dual stepper motor drive independently controls the oscillation speed and amplitude of the grinding fixture, improving workpiece flatness, surface finish, and consumable utilization.

Product Features

● Grinding disc size: 8 inches (Φ203mm);

● Grinding disc speed: 0–600 rpm, reversible (clockwise/counterclockwise);

● LCD screen displays real-time material removal, resolution 1μm, stable accuracy 10μm;

● Programmable material removal amount, resolution 1μm, stable accuracy 10μm; equipment automatically stops when the set removal value is reached;

● Programmable grinding time; equipment automatically stops when the set time is reached;

● 7-inch LCD display/touchscreen, capable of saving/editing at least 20 parameter sets;

● Sample rotation: can self-rotate, remain stationary, or oscillate with adjustable amplitude;

● Auto/manual control of coolant water on/off;

● Spindle motor power: 750W, servo motor with high torque and constant torque output; sample oscillation driven by stepper motor for greater torque and durability.