The WIT-1 fully automatic intelligent sample preparation system is specially developed for cross-section slice detection in the semiconductor, PCB and other industries. It can be applied to the precise positioning detection and analysis of PCB hole copper, solder joints, tin balls, etc. With the help of high-definition CCD cameras to calibrate the grinding position, it can automatically realize the processes of coarse grinding, fine grinding, fine polishing, cleaning, etc.
Key Features
Uses high-precision CCD lens for sample calibration with high accuracy and large field of view
Grinding accuracy up to ±10μm
Multiple grinding lines can be calibrated on the same sample at once
After finishing one cut, automatically proceed to the next cut without re-calibration
Equipped with 4 groups of different polishing liquids, of which 2 groups have mechanical stirring function
All 4 groups have liquid level alarm function
Control Panel Components
● Main Screen Display - 15-inch main control screen for parameter setting and monitoring
● Sub-Screen Display - 7-inch sub-screen for auxiliary information display
● Computer Screen - Dual 24-inch displays for comprehensive monitoring
● Program Selection - Select from 30 pre-programmed preparation programs
● Process Step Display - Display current process step status
● CCD Camera System - High-definition 25MP camera for precise positioning
● Laser Marking Control - Laser marking for sample traceability
● Pressure Setting - Control grinding/polishing pressure (5-100N)
● Speed Setting - Control grinding/polishing speed
● Emergency Stop - Emergency stop button for safety
● Start/Stop Control - Start and stop the preparation process
● Three-Color Warning Light - Status indication with three-color light
● Dosing System Control - Control 4 groups of polishing liquids
● Cleaning System Control - Ultrasonic, water flow, and air drying control
● Disc Changing Control - Automatic grinding disc changing system
Application Fields
The WIT-1 Fully Automatic Intelligent Sample Preparation System is ideal for:
• Semiconductor Industry: Cross-section slice detection and analysis
• PCB Industry: PCB hole copper, solder joints, tin balls precise positioning detection
• Electronic Components: Solder joint inspection, ball grid array analysis
• Metallographic Analysis: Cross-section sample preparation
• Quality Control: Automated quality inspection and analysis
• Research and Development: Material research and development
• High-Volume Production: Large-scale sample preparation
• Precision Analysis: High-precision positioning and grinding
• Automated Workflows: Fully automated grinding, polishing, and cleaning processes
• Laboratory Applications: Comprehensive automated sample preparation solutions
Technical Specifications
| Parameter | Specification |
| Input Power | AC 220V/50 Hz + Ground wire, total power 7Kw, rated power 2Kw |
| Input Air Source | 0.6-0.7MPa, OD=Ø10mm air pipe |
| Input Water Source | <0.3Mpa, OD=Ø10mm water pipe |
| Sample Type | Square mold box, size 39x47x12mm / 30*27*12mm, maximum quantity 21 |
| Output Drain | OD=32mm drainage pipe |
| Output Discharge | Samples are discharged with grinding surface facing up and arranged in order |
| Emergency Stop | Press to cut off control circuit and power supply |
| Safety Door Lock | Safety relay and safety door lock, PLD safety protection level |
| Three-Color Warning Light | Available |
| PLC Control | Main screen 15 inches / sub-screen 7 inches |
| Computer Screen | Dual displays, 24 inches |
| CCD Camera | 25 million pixels |
| Photography Field of View | 35x35mm |
| Laser Marking/Reading | Available |
| Maximum Number of Lines | 30 lines |
| Line Drawing Method | Specified distance translation based on feature lines |
| Grinding Stations | 2 |
| Grinding Disc Diameter | Ø254mm |
| Grinding Disc Speed | 100-1000rpm |
| Grinding Motor Power | 1Kw |
| Sample Clamping Quantity | 3 |
| Moving Head Motor Power | 0.4Kw |
| Moving Head Speed | 0-360° reciprocating oscillation |
| Moving Head Pressure | 5-100N |
| Dosing Groups | 4 groups × 1.8L |
| Dosing Flow Rate | 0-50 mL/min |
| Stirring | 2 groups, mechanical stirring method |
| Liquid Level Alert | Available |
| Grinding Disc Storage Capacity | 20 |
| Grinding Disc Life | Reminder based on usage times or grinding force |
| Cleaning Method | Water flushing, ultrasonic, high-speed spin drying of grinding disc |
| Air Drying Station | Independent air drying |
| Program Library | 30 groups |
| Maximum Process Steps | 10 steps |
| Step Completion Condition | Remaining grinding amount [minimum 0.001mm], grinding amount [minimum 0.001mm] or grinding time |
| Grinding Method per Step | By pressure [0-100N] or speed [minimum 0.001mm/s] |
| Dimensions (with folded screen and lights) | 2400x1320x2000mm |
| Net Weight | 1500kg |
Related Consumables and Related Accessories
Related consumables are available for this product. Please contact sales for detailed information.