Parameter | Specification |
Product | SO A439 |
Type | Colloidal silica polishing suspension |
pH | ~10 |
Particle size | 0.04μm (40nm) |
SiO₂ content | 40% |
Specification | 500ml, 1L |
SO-A439 Colloidal Silica Polishing Suspension
Fine 0.05um Silica Suspension, PH ~10.2
Provides excellent surface fnish throughchemical mechanical polishing.
Used for fnal polishing of materials such astin,aluminum,semiconductor,PCB and others.
5.0
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Required Products
Total price discount:
Technical Specifications
ordering information
Order NO： | Description | Package |
06.07.310 | 50nm | 500 ml |
06.07.320 | 50nm | 1000 ml |
06.07.322 | 50nm | 1.9 L |
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