This epoxy resin is a special fast-curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), and it can be cured into a colorless to light yellow transparent hard material after 30-60 minutes. It has superior adhesion, very low shrinkage and low tackiness. It can penetrate into the openings and through holes of the sample, and can maintain the edge and support of the sample to the greatest extent. It is suitable for use as a microsection curing adhesive in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

This epoxy resin is a special fast-curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), and it can be cured into a colorless to light yellow transparent hard material after 30-60 minutes. It has superior adhesion, very low shrinkage and low tackiness. It can penetrate into the openings and through holes of the sample, and can maintain the edge and support of the sample to the greatest extent. It is suitable for use as a microsection curing adhesive in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

This epoxy resin is a special fast-curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), and it can be cured into a colorless to light yellow transparent hard material after 30-60 minutes. It has superior adhesion, very low shrinkage and low tackiness. It can penetrate into the openings and through holes of the sample, and can maintain the edge and support of the sample to the greatest extent. It is suitable for use as a microsection curing adhesive in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

Acrylic resin agent is a resin glue composed of powder and liquid, that is, composed of acrylic powder and liquid mounting agent. The acrylic powder is white powder, the mounting agent is colorless to light green transparent liquid. After mixing the mounting agent and acrylic powder for 8-10 minutes at room temperature (20-25°C), it can be cured into a transparent or translucent hard material, and the material can be ground and polished. It has the advantages of low heat release, small thermal shrinkage, good weather fastness and good wear resistance. It is suitable for permanent specimens and micro slicing mounting material for circuit board and metalworking industry.

Acrylic resin agent is a resin glue composed of powder and liquid, that is, composed of acrylic powder and liquid curing agent. The acrylic powder is white powder, the curing agent is colorless to light green transparent liquid. After mixing the curing agent and acrylic powder for 10-15 minutes at room temperature (20-25°C), it can be cured into a transparent or translucent hard material, and the material can be ground and polished. It has the advantages of low heat release, small thermal shrinkage, good weather fastness and good wear resistance.

UVmount is a cold mounting system that utilizes ultraviolet (UV) light to rapidly cure resin in as little as 60 seconds. By pouring the liquid resin into dedicated molds and placing them inside the chamber, up to 20 fully transparent specimens can be prepared simultaneously. With its streamlined operation and ultrafast curing process, UVmount delivers efficient and high-quality sample preparation.

ThetaVAC-2 is a program-controlled vacuum mounting machine. This system is ideal for vacuum embedding with epoxy resin, offering excellent porosity impregnation capabilities. It allows epoxy resin to penetrate small pores and cracks quickly and effectively, ensuring edge protection and thorough filling of sample. The ThetaVAC-2 is particularly well-suited for preparing porous materials and is widely used in preparation of failure analysis samples for cracked components, porous castings, composite materials, as well as electronic components, rocks, minerals, and ceramics.

Trojan offers a complete solution for mounting accessories. Metal fixtures can be used to secure samples for hot mounting，while plastic fixtures are suitable for securing samples for cold mounting.

Trojan offers a complete solution for mounting accessories. Metal fixtures can be used to secure samples for hot mounting，while plastic fixtures are suitable for securing samples for cold mounting.

Theta Vacuum is a cold mounting machine that has integrated a vacuum pump and a vacuum device. It can ensure that the specimen does not contain air bubbles during the mounting process, while ensuring the rapid curing of cold mounting on epoxy resins, without affecting the physical and chemical properties of the resin and curing agent at all. This machine is suitable for fast mounting of epoxy resins and makes high quality samples.

MT-2H Automatic Hot Mounting Machine is equipped with a 7-inch touch screen for intuitive operation. It features a hydraulic pressing system, making it suitable for hot mounting of various materials, such as epoxy resin, bakelite powder, and acrylic powder. Designed for versatility and efficiency, the system ensures consistent, high-quality specimen preparation.

ThetaMount cold Press is designed with compact pressure technology. It can reach a maximum pressure of 2 bar, ensures that cold inlay patterns are free of air bubbles during curing process. This machine ensures rapid curing of cold mounting resin without affecting physical and chemical properties of cold mounting resin and curing agent mixture.So it can be used for rapid curing of all cold mounting resins (Especially for TJ-2210 acrylic resin) and making high quality specimens.