Material | TJ 2568 |
Part A | Epoxy Resin, Liquid |
Part B | Hardener, Liquid |
A : B ( w/w ) | 4.5 : 1 |
Mixing Time | 5-10 min |
Curing Time 25˚C | 45-90 min |
Peak temperature | 125 °C |
Hardness ( Shore D ) | 82 |
Edge protection | Excellent |
This epoxy resin is a special fast-curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), and it can be cured into a colorless to light yellow transparent hard material after 30-60 minutes. It has superior adhesion, very low shrinkage and low tackiness. It can penetrate into the openings and through holes of the sample, and can maintain the edge and support of the sample to the greatest extent. It is suitable for use as a microsection curing adhesive in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.
Features
Technical Specifications
Material | TJ 2568 |
Part A | Epoxy Resin, Liquid |
Part B | Hardener, Liquid |
A : B ( w/w ) | 4.5 : 1 |
Mixing Time | 5-10 min |
Curing Time 25˚C | 45-90 min |
Peak temperature | 125 °C |
Hardness ( Shore D ) | 82 |
Edge protection | Excellent |
ordering information
Order NO: | Description | Package |
02.04.855 | Epoxy Resin, Liquid | 4.5 kg |
02.04.856 | Epoxy Hardener, Liquid | 1 kg |
02.04.857 | Epoxy Resin, Liquid | 1 kg |
02.04.858 | Epoxy Hardener, Liquid | 230 g |