Material | TJ 2228 |
Part A | Epoxy Resin, Liquid |
Part B | Hardener, Liquid |
A : B ( w/w ) | 2 : 1 |
Mixing Time | 10-20 min |
Curing Time 25˚C | 8-12 h |
Peak temperature | 40°C |
Hardness ( Shore D ) | 80 |
Edge protection | Better |
This epoxy resin is a special slow curing cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), it can be cured into transparent hard material after 8~12hours and the material can be polished and grinded. The material can meet the requirements of mounting various inorganic material samples. It has the advantages of good edge protection performance, good adhesion and very low shrinkage. It is suitable for microsection curing glue in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.
Features
Technical Specifications
Material | TJ 2228 |
Part A | Epoxy Resin, Liquid |
Part B | Hardener, Liquid |
A : B ( w/w ) | 2 : 1 |
Mixing Time | 10-20 min |
Curing Time 25˚C | 8-12 h |
Peak temperature | 40°C |
Hardness ( Shore D ) | 80 |
Edge protection | Better |
ordering information
Order NO: | Description | Package |
02.04.871 | Epoxy Resin, Liquid | 2 kg |
02.04.872 | Epoxy Hardener, Liquid | 1kg |