Diamond wafering blades can be used to cut highly hard and brittle materials, and are widely used for cutting materials such as ceramics, glass, gemstones, semiconductors, circuit boards (PCB) and so on. Diamond saw blades consist of two main parts: the matrix and the cutter head. The matrix is the main support part of the bonded the cutter head, while the cutter head is the part that cuts in the process of use. The cutter head will be consumed in use, while the matrix will not. The reason why the cutter head can play a role in cutting is because of the diamond contained in it. Diamond, as the hardest substance, which is friction in the cutter head to cut the processed object, and diamond particles are wrapped by the inlaid material in the internal of the cutter head.

At present, in the professional metallographic laboratory, most of the cutting only uses one type of grinding wheel to cut metallographic samples of various materials and hardness. This unscientific method is not only inefficient, but also causes damage to the sample, or causes serious deformation of the sample layer, which is not easy to be completely eliminated in the subsequent grinding and polishing process, and affects the quality of metallographic sample preparation.

CT-300 is a user-friendly and powerful manual cutting machine. It is designed for cutting samples of various shapes, sizes, and complex materials. The upward-sliding safety door allows quick and easy sample placement. Equipped with a robust motor and an ergonomically designed cutting arm, it ensures efficient and stable cutting. Simple to operate and easy to learn.