Material | TJ 2227 |
Part A | Epoxy Resin, Liquid |
Part B | Hardener, Liquid |
A : B ( w/w ) | 2 : 1 |
Mixing Time | 5-10 min |
Curing Time 25˚C | 2-3 h |
Peak temperature | 90 ° C |
Hardness ( Shore D ) | 82 |
Edge protection | Excellent |
This epoxy resin is a special conductive cold mounting material, which consists of two components--resin and curing agent, both in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), and it can be cured into conductive hard material after 4-6 hours and the material can be polished and grinded. It has the advantages of good edge protection performance, good adhesion and very low shrinkage. It is suitable for SEM, EDS, EBSD and other electron microscopy sample preparation.
Features
Technical Specifications
Material | TJ 2227 |
Part A | Epoxy Resin, Liquid |
Part B | Hardener, Liquid |
A : B ( w/w ) | 2 : 1 |
Mixing Time | 5-10 min |
Curing Time 25˚C | 2-3 h |
Peak temperature | 90 ° C |
Hardness ( Shore D ) | 82 |
Edge protection | Excellent |
ordering information
Order NO: | Description | Package |
02.04.920 | Epoxy Resin, Liquid | 1 kg |
02.04.921 | Epoxy Hardener, Liquid | 0.5 kg |