Key Features
Grinding Accessories
Application Fields
The FlexPRESS Automatic Modular Hot Mounting System is ideal for:
• Metallographic Sample Preparation: Various metal materials
• Electronic Components: PCB boards, semiconductor materials
• Ceramic Materials: Technical ceramics, structural ceramics
• Mineral and Rock Samples: Petrographic samples, geological specimens
• Research Applications: Material science research, quality control, failure analysis
• Batch Processing: High-efficiency batch mounting operations
Technical Specifications
| Parameter | Specification |
| Model | FlexPRESS Basic unit, FlexPRESS Extended unit |
| Voltage | 110/220V |
| Heating Power | 2.0Kw |
| Mold Size | Φ30mm(Standard),Φ25.4mm,Φ32mm,Φ40mm,Φ50mm(Optional) |
| Heating Range | 60~250˚C |
| Holding Time | 1 ~ 60Min |
| Safety | 0~500Bar (Depending on the mold size) |
| Heating Position | Heating from around and top |
| Heating Method | First preheating, then insulation or without preheating |
| Pressurized Method | Pre-pressurize first, then hold the pressure (also without pre-pressure) |
| Cooling Mode | Auto:by temperature or time; manual mode |
| Cooling Rate | High, medium and low |
| Control Panel | 7-inch touch screen Push buttons |
| Environment Temperature | -20˚C - 60˚C |
| Environment Humidity | 0-95%RH |
| Dimension (WxDxH) | 300×561×492mm, 254×550×492mm |
| Weight | 60Kg, 52Kg |
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